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Priya Anand

Priya Anand covers wafer foundry services and process-node transitions, and reads investor-call transcripts line by line before writing a word.

Automated Test Equipment Basics for Beginners (2026)

October 3, 2026 by Priya Anand
automated test equipment basics for beginners

Automated test equipment basics for beginners start with one idea: a machine applies known electrical signals to a part, measures what comes back, compares … Read more

Categories Packaging And Test Leave a comment

How Chips Are Tested After Manufacturing: A Guide (2026)

October 3, 2026 by Priya Anand
how chips are tested after manufacturing

How chips are tested after manufacturing comes down to two main stages. Wafer sort, also called wafer probe test, happens while the die is … Read more

Categories Packaging And Test Leave a comment

Defect Density Explained for Chip Manufacturing (2026)

October 3, 2026 by Priya Anand
defect density explained for chip manufacturing

Defect density explained for chip manufacturing comes down to one number: the average number of defects per square centimeter of wafer area, usually written … Read more

Categories Wafer Fabrication Leave a comment

How Chip Process Nodes Are Named and Why They Are Misleading 2026

October 2, 2026 by Priya Anand
how chip process nodes are named and why they are misleading

A chip process node is a name for a foundry’s manufacturing process, and for most of the last two decades that name has been … Read more

Categories Process Technology Leave a comment

Photolithography Process Explained for Beginners (2026)

October 2, 2026 by Priya Anand
photolithography process explained for beginners

Photolithography is the process of using light to transfer a circuit pattern from a photomask onto a light-sensitive coating called photoresist, which sits on … Read more

Categories Process Technology Leave a comment

Corner Analysis in Chip Design: Timing Corners Explained (2026)

October 2, 2026 by Priya Anand
corner analysis in chip design explained

Corner analysis in chip design is the practice of running a design against the extreme combinations of process, voltage and temperature it must survive, … Read more

Categories Chip Design Leave a comment
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Latest

  • ESD Protection in Chip Design Explained: A Guide (2026)
  • Scanning Electron Microscope for Semiconductor Failure Analysis 2026
  • What Electromigration Is and Why It Kills Chips: A Guide 2026
  • Failure Analysis Methods for Chips Explained (October 2026)
  • Metrology and Inspection in Chip Fabs Explained (2026)
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