Packaging And Test

A thermal interface material is a thermally conductive compound, film, gel or metal placed between a heat-generating chip and its heat spreader, lid, heat … Read more

Fan out wafer level packaging (FOWLP) is a semiconductor packaging method that embeds bare die in mold compound and routes every connection outward through … Read more

A through-silicon via (TSV) is a vertical electrical connection that passes completely through a silicon wafer or die, so that circuits on the front … Read more

Hybrid bonding is a way of joining two dies or two wafers directly, with copper-to-copper contacts and a dielectric-to-dielectric bond, and with no solder … Read more

Short answer: 2.5D packaging puts two or more separately made chip dies next to each other on a thin shared silicon interposer, using very … Read more

The wire bonding vs flip chip packaging decision comes down to one binding constraint. If your die needs hundreds of interconnects at high speed, … Read more

Chip packaging is the back-end process that turns a fragile silicon die cut from a wafer into a finished, mountable component. The die gets … Read more

Flip chip packaging is a way of connecting a bare semiconductor die to a substrate or circuit board: the die is turned face-down so … Read more

Burn in testing for semiconductors is a screening step where devices are held at elevated temperature, usually with elevated supply voltage and continuous current, … Read more

Automated test equipment basics for beginners start with one idea: a machine applies known electrical signals to a part, measures what comes back, compares … Read more