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Priya Anand

Priya Anand covers wafer foundry services and process-node transitions, and reads investor-call transcripts line by line before writing a word.

Scanning Electron Microscope for Semiconductor Failure Analysis 2026

October 3, 2026 by Priya Anand

Scanning electron microscope use in semiconductor failure analysis is about looking where the fault is hidden. When a part fails electrically, the SEM gives … Read more

Categories Process Technology Leave a comment

Metrology and Inspection in Chip Fabs Explained (2026)

October 3, 2026 by Priya Anand
metrology and inspection in chip fabs explained

Metrology and inspection in chip fabs explained starts with one simple split: metrology measures a known process parameter, and inspection looks for something that … Read more

Categories Wafer Fabrication Leave a comment

Reticle and Stepper Basics Explained Simply for Chipmakers 2026

October 3, 2026 by Priya Anand
reticle and stepper basics explained

A reticle is the patterned glass plate that holds a chip’s circuit layout, and a stepper is the machine that repeatedly prints that layout … Read more

Categories Process Technology Leave a comment

Critical Dimension Measurement Explained for IC Fabs (October 2026)

October 3, 2026 by Priya Anand
critical dimension measurement explained

Critical dimension measurement is how a fab measures the width, height or sidewall profile of a printed feature so it can hold it inside … Read more

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What Gases Are Used in Chip Manufacturing? October 2026 Guide

October 3, 2026 by Priya Anand
what gases are used in chip manufacturing

What gases are used in chip manufacturing? Chip fabs run on ultra-high-purity process gases grouped into five functional families: deposition, etching, dopant, chamber cleaning, … Read more

Categories Wafer Fabrication Leave a comment

How Heat Is Removed from Modern Processors 2026

October 3, 2026 by Priya Anand
how heat is removed from modern processors

Here is how heat is removed from modern processors: it leaves through a chain of touching parts. It conducts out of the silicon die … Read more

Categories Process Technology Leave a comment

How Fabs Handle Contamination Control: A Fab Guide for 2026

October 3, 2026 by Priya Anand
how fabs handle contamination control

Contamination control in a semiconductor fab is the coordinated set of engineering and operational measures — cleanroom design, ultra-high-purity chemical and gas delivery, particle-controlled … Read more

Categories Wafer Fabrication Leave a comment

Fan Out Wafer Level Packaging Explained: A Practical Guide 2026

October 3, 2026 by Priya Anand
fan out wafer level packaging explained

Fan out wafer level packaging (FOWLP) is a semiconductor packaging method that embeds bare die in mold compound and routes every connection outward through … Read more

Categories Packaging And Test Leave a comment

Chiplets Explained for Beginners: A Simple Guide (October 2026)

October 3, 2026 by Priya Anand
chiplets explained for beginners

A chiplet is a small die that does one job well, manufactured separately and then joined electrically to other dies inside a single package, … Read more

Categories Chip Design IP Leave a comment

Burn In Testing for Semiconductors Explained (2026)

October 3, 2026 by Priya Anand
burn in testing for semiconductors explained

Burn in testing for semiconductors is a screening step where devices are held at elevated temperature, usually with elevated supply voltage and continuous current, … Read more

Categories Packaging And Test Leave a comment
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  • Scanning Electron Microscope for Semiconductor Failure Analysis 2026
  • What Electromigration Is and Why It Kills Chips: A Guide 2026
  • Failure Analysis Methods for Chips Explained (October 2026)
  • Metrology and Inspection in Chip Fabs Explained (2026)
  • Reticle and Stepper Basics Explained Simply for Chipmakers 2026
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